Asia Pacific Generative AI Chips Market Size and Forecast by Product Type, Node Type, Power & Cooling Envelope, and End-User Segment: 2019-2033

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Industry Assessment Overview

Industry Findings: Asia Pacific’s rapid manufacturing scale, coupled with large sovereign investments and hyperscaler activity in China and India, is creating the highest absolute demand growth globally; the region’s combination of foundry, OSAT, and assembly resources is enabling faster prototype-to-volume transitions for HBM-attached devices and chiplet assemblies.

Industry Progression: Micron’s announced $9.6B investment in an HBM-capable plant in Japan (reported in Nov-2025) is a material APAC development: this supply-line investment directly supports the acceleration of memory-intensive accelerators across the region, easing a key HBM constraint and enabling higher ASP ASIC rollouts in 2028+.

Industry Player Insights: Micron’s ongoing Japan-based HBM expansion initiatives, combined with TSMC’s confirmed regional capacity growth, are strengthening memory and packaging availability across Asia-Pacific. This improves access to HBM-attached ASICs for OEMs and hyperscalers and helps shorten deployment timelines by reducing long-distance logistics.