China Generative AI Chips Market Size and Forecast by Product Type, Node Type, Power & Cooling Envelope, and End-User Segment: 2019-2033

  Dec 2025   | Format: PDF DataSheet |   Pages: 110+ | Type: Niche Industry Report |    Authors: David Gomes (Senior Manager)  

 

China Generative AI Chips Market Outlook

  • In 2024, the China market accounted for USD 7.90 billion.
  • Our assessment shows the China Generative AI Chips Market is expected to reach USD 125.57 billion by 2033, achieving a CAGR of 26.7% during the forecast period.
  • DataCube Research Report (Nov 2025): This analysis uses 2024 as the actual year, 2025 as the estimated year, and calculates CAGR for the 2025-2033 period.

Industry Assessment Overview

Industry Findings: China’s combined strategy of domestic vertical integration—chip design, memory, packaging—and aggressive scale-up by cloud players is shifting purchasing toward locally developed accelerators and memory-heavy platforms; intensified sanctions/controls have reinforced a self-reliant supply posture and encouraged rapid IP commercialization, a trend with measurable lift across 2024–2025.

Industry Progression: Huawei’s plan to mass-produce its 910C AI chip was reported in Nov-2024, and this production push indicates China’s intent to scale indigenous accelerators despite export controls. The commercial consequence: faster domestication of high-performance inference and training capacity, growing demand for HBM and advanced packaging domestically, and a stronger ecosystem for local ASIC vendors to capture hyperscaler orders.

Industry Player Insights: Among the broad mix of companies in China, the competitive footprint is influenced by Huawei, Alibaba (Pingtouge), Cambricon, and SMIC etc. Huawei’s 910C ramp plans (Nov-2024) and Alibaba/Baidu custom-silicon projects push domestic hyperscalers to source local accelerators, while Cambricon and SMIC’s foundry/design linkages (2023–2025) provide an integrated path from IP to volume — raising local ASPs and shortening lead times.

*Research Methodology: This report is based on DataCube’s proprietary 3-stage forecasting model, combining primary research, secondary data triangulation, and expert validation. [Learn more]

Market Scope Framework

Product Type

  • GPUs
  • TPUs
  • ASICs
  • FPGAs
  • Neuromorphic Chip

Node Type

  • Standard Accelerator Nodes
  • High-Density Accelerator Nodes
  • Supernode Clusters

Power & Cooling Envelope

  • Envelope 1 ≤ 4 kW
  • Envelope 2 = 4–20 kW
  • Envelope 3 ≥ 20 kW

End-User Segment

  • Hyperscale Cloud Service Providers (CSPs)
  • Large-Scale Internet & AI-Native Companies
  • AI Hardware OEMs / System Integrators
  • Edge/Embedded Device Manufacturers
  • Automotive & Autonomous Systems Manufacturers
  • Semiconductor Manufacturers
  • Other
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