Industry Findings: China’s combined strategy of domestic vertical integration—chip design, memory, packaging—and aggressive scale-up by cloud players is shifting purchasing toward locally developed accelerators and memory-heavy platforms; intensified sanctions/controls have reinforced a self-reliant supply posture and encouraged rapid IP commercialization, a trend with measurable lift across 2024–2025.
Industry Progression: Huawei’s plan to mass-produce its 910C AI chip was reported in Nov-2024, and this production push indicates China’s intent to scale indigenous accelerators despite export controls. The commercial consequence: faster domestication of high-performance inference and training capacity, growing demand for HBM and advanced packaging domestically, and a stronger ecosystem for local ASIC vendors to capture hyperscaler orders.
Industry Player Insights: Among the broad mix of companies in China, the competitive footprint is influenced by Huawei, Alibaba (Pingtouge), Cambricon, and SMIC etc. Huawei’s 910C ramp plans (Nov-2024) and Alibaba/Baidu custom-silicon projects push domestic hyperscalers to source local accelerators, while Cambricon and SMIC’s foundry/design linkages (2023–2025) provide an integrated path from IP to volume — raising local ASPs and shortening lead times.