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Eastern Europe Generative AI TPUs Market Size and Forecast by Component, Node Type, Power & Cooling Envelope, and End User: 2019-2033

  Dec 2025   | Format: PDF DataSheet |   Pages: 160+ | Type: Niche Industry Report |    Authors: Sumeet KP (Senior Manager)  

 

Eastern Europe Generative AI TPUs Market Outlook

  • The sector in Eastern Europe valued at USD 56.3 million in 2024, reflecting a YoY increase of 21.6%.
  • Our sector research points to the fact that by 2033, the Eastern Europe Generative AI TPUs Market is likely to hit USD 373.4 million, with an anticipated CAGR of 23.5% during the forecast window.
  • Rapid cloud expansion in select hubs drives demand for hyperscaler-grade carrier boards, with local integrators competing on price and accelerated node qualification services.
  • DataCube Research Report (Nov 2025): This analysis uses 2024 as the actual year, 2025 as the estimated year, and calculates CAGR for the 2025-2033 period.
*Research Methodology: This report is based on DataCube’s proprietary 3-stage forecasting model, combining primary research, secondary data triangulation, and expert validation. [Learn more]

Market Scope Framework

Component

  • TPU ASIC (Logic Die)
  • HBM & Memory Stacks
  • Optical Transceivers
  • Power & Voltage Regulation Modules
  • Other

Node Type

  • Standard TPU Server Node
  • High-Density Training Node
  • Inference-Optimized Node
  • Edge Inference Server Node
  • Liquid-Cooled Node

Power & Cooling Envelope

  • Low-power (≤150W per module)
  • Medium-power (150W–500W per card/module)
  • High-power (>500W per board/rack)

End User

  • Hyperscale Cloud Service Providers (CSPs)
  • OEM / System Integrators
  • Edge OEMs / Device Makers
  • Other

Countries Covered

  • Russia
  • Poland
  • Rest of Eastern Europe
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