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Hong Kong Generative AI ASICs Market Size and Forecast by Offering, Substrate, Process Node, Packaging & Integration, Performance Tier, Application, and End User: 2019-2033

  Dec 2025   | Format: PDF DataSheet |   Pages: 110+ | Type: Niche Industry Report |    Authors: Sumeet KP (Senior Manager)  

 

Hong Kong Generative AI ASICs Market Outlook

  • In 2024, Hong Kong recorded a market value worth USD 61.2 million.
  • The Hong Kong Generative AI ASICs Market to total USD 614.4 million by 2033, achieving a CAGR of 25.6% across the forecast period.
  • Financial ecosystems prefer low-latency HBM modules for on-prem inference, prioritizing secure, high-throughput designs for algorithmic trading and surveillance analytics.
  • DataCube Research Report (Nov 2025): This analysis uses 2024 as the actual year, 2025 as the estimated year, and calculates CAGR for the 2025-2033 period.
*Research Methodology: This report is based on DataCube’s proprietary 3-stage forecasting model, combining primary research, secondary data triangulation, and expert validation. [Learn more]

Market Scope Framework

Offering

  • Full-Reticle Generative ASICs
  • SoC ASICs (Embedded Host/Control)
  • Chiplet / Multi-Die ASIC Assemblies
  • HBM-Co-Packaged ASICs
  • Reference Accelerator Boards / Modules

Substrate

  • Digital ASIC
  • Mixed-Signal / Analog-Augmented
  • Photonic / Electro-Photonic

Process Node

  • Leading Edge (<7nm)
  • Mid Nodes (7–16nm)
  • Mature Nodes (>16nm)

Packaging & Integration

  • Monolithic Reticle
  • Chiplet / MCM
  • HBM-Co-Packaged

Performance Tier

  • Ultra High-Performance
  • Edge Performance
  • Low-Power / TinyML

Application

  • LLM / Transformer Inference
  • Diffusion / Generative Imaging
  • Audio & Speech Generation
  • Training Primitives / Fine-Tuning

End User

  • Hyperscalers & CSPs
  • OEMs & System Integrator
  • Consumer & Edge Device Manufacturer
  • Defense & Research
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