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Poland Generative AI Chips Market Size and Forecast by Product Type, Node Type, Power & Cooling Envelope, and End-User Segment: 2019-2033

  Dec 2025   | Format: PDF DataSheet |   Pages: 110+ | Type: Niche Industry Report |    Authors: David Gomes (Senior Manager)  

 

Poland Generative AI Chips Market Outlook

  • As recorded in 2024, the Poland market amounted to USD 471.4 million.
  • Our data-backed projections indicate the Poland Generative AI Chips Market to total USD 6.28 billion by 2033, with a forecast CAGR of 25.8% across the forecast timeframe.
  • DataCube Research Report (Nov 2025): This analysis uses 2024 as the actual year, 2025 as the estimated year, and calculates CAGR for the 2025-2033 period.

Industry Assessment Overview

Industry Findings: Poland is using targeted public aid frameworks to attract wafer and packaging investment while building skilled AI engineering clusters; these measures are increasing the regional attractiveness for integrated accelerator production and for firms seeking an EU-compliant production base.

Industry Progression: Poland’s updated semiconductor support program (published in Sep-2025) outlines thresholds and aid rules to attract integrated production facilities; this legal certainty catalyses investor interest and accelerates planning for packaging and OSAT projects that can support accelerator module volumes for EU customers.

Industry Player Insights: Recent incentive programs supporting semiconductor and AI clusters are prompting global vendors and local integrators to evaluate capacity placement in Poland. Integrators such as Asseco and Comarch will play critical roles in delivering accelerator-equipped systems to public-sector buyers and enterprises seeking sovereign-aligned compute infrastructure.
*Research Methodology: This report is based on DataCube’s proprietary 3-stage forecasting model, combining primary research, secondary data triangulation, and expert validation. [Learn more]

Market Scope Framework

Product Type

  • GPUs
  • TPUs
  • ASICs
  • FPGAs
  • Neuromorphic Chip

Node Type

  • Standard Accelerator Nodes
  • High-Density Accelerator Nodes
  • Supernode Clusters

Power & Cooling Envelope

  • Envelope 1 ≤ 4 kW
  • Envelope 2 = 4–20 kW
  • Envelope 3 ≥ 20 kW

End-User Segment

  • Hyperscale Cloud Service Providers (CSPs)
  • Large-Scale Internet & AI-Native Companies
  • AI Hardware OEMs / System Integrators
  • Edge/Embedded Device Manufacturers
  • Automotive & Autonomous Systems Manufacturers
  • Semiconductor Manufacturers
  • Other
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