South Korea AI Processor Chip Market Size and Forecast by Hardware Architecture, Power Envelope, Memory Integration Type, Node Type, and End User: 2019-2033

  Dec 2025   | Format: PDF DataSheet |   Pages: 110+ | Type: Niche Industry Report |    Authors: Surender Khera (Asst. Manager)  

 

South Korea AI Processor Chip Market Outlook

  • In 2024, market figures stood at USD 4.43 Billion in South Korea.
  • As per our research, the South Korea AI Processor Chip Market to reach USD 27.32 Billion by 2033, with a forecasted CAGR of 22.0% across the projection period.
  • DataCube Research Report (Dec 2025): This analysis uses 2024 as the actual year, 2025 as the estimated year, and calculates CAGR for the 2025-2033 period.

Industry Assessment Overview

Industry Findings: Regulatory certainty and memory-prioritised procurement dominate South Korea’s compute demand profile as the state balances industrial competitiveness with trust and safety. Lawmakers advanced the AI Basic Act in Dec-2024, creating a national framework that mandates transparency, establishes implementation bodies and sets compliance timelines for high-impact systems. That legislative milestone forces enterprise buyers and public agencies to favour accelerators that provide deterministic telemetry and reproducible inference metrics out of the box. Near term, procurement teams will weigh auditability and explainability as hard selection criteria for hardware–software stacks; over the medium term, the law will push vendors to embed provenance, logging and certified toolchains into product roadmaps to remain eligible for government and regulated-industry tenders.

Industry Player Insights: South Korea’s market transformation is influenced by Samsung, SK hynix, LG Electronics, and Naver etc. Samsung announced the development of a 36GB HBM3E 12-stack memory architecture in Feb-2024, accelerating the memory roadmap available to AI accelerator designers and narrowing the gap with incumbent HBM suppliers. SK hynix began volume production of HBM3E in Mar-2024, bolstering regional memory availability for domestic and export-oriented accelerator builders and easing short-term supply constraints for high-bandwidth inference platforms. These supplier moves materially improve memory-side throughput options for Korean integrators and increase the feasibility of domestic rack-level AI solutions for hyperscalers and industrial OEMs.

*Research Methodology: This report is based on DataCube’s proprietary 3-stage forecasting model, combining primary research, secondary data triangulation, and expert validation. [Learn more]

Market Scope Framework

Hardware Architecture

  • GPU Accelerators
  • Domain-Specific AI ASIC/NPU/TPU
  • FPGA Accelerators
  • Hybrid/Heterogeneous Processors
  • DPU/Dataflow Processors

Power Envelope

  • Ultra-Low Power (Sub-5W)
  • Low Power (5–50W)
  • Mid Power (50–300W)
  • High Power (300–700W)

Memory Integration Type

  • On-Package HBM
  • On-Chip SRAM
  • External DRAM Interface

Node Type

  • Leading Edge (<7nm)
  • Performance Node (7–12nm)
  • Mature Node (>12nm)

End User

  • Hyperscalers & Cloud Providers
  • Enterprise Datacenters
  • OEMs / ODMs / System Integrators
  • Consumer Electronics Manufacturers
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