Thailand Generative AI Chips Market Size and Forecast by Product Type, Node Type, Power & Cooling Envelope, and End-User Segment: 2019-2033

  Dec 2025   | Format: PDF DataSheet |   Pages: 110+ | Type: Niche Industry Report |    Authors: David Gomes (Senior Manager)  

 

Thailand Generative AI Chips Market Outlook

  • In 2024, the sector in Thailand was valued at USD 319.2 million.
  • The Thailand Generative AI Chips Market is expected to expand to USD 5.04 billion by 2033, recording a CAGR of 26.4% over the forecast window.
  • DataCube Research Report (Nov 2025): This analysis uses 2024 as the actual year, 2025 as the estimated year, and calculates CAGR for the 2025-2033 period.

Industry Assessment Overview

Industry Findings: A compelling dynamic is emerging where telco-led AI hubs accelerate edge-first adoption: telcos’ commercial AI platforms and enterprise partnerships are pushing procurement toward compact, telco-optimised accelerator appliances for inference at the edge. This telco-centric demand surfaced strongly in Jan-2025, making telecom integrators pivotal channel partners for accelerator vendors targeting Thai enterprises.

Industry Progression: True Corporation and other Thai telcos launched enterprise AI platforms and model access capabilities in Jan-2025, a development that materially expands commercial channels for edge accelerators and creates immediate demand for rack-scale and appliance-form factor ASIC modules tailored to low-latency telco environments.

Industry Player Insights: True Corporation’s announced mid-decade AI investments, along with Huawei and AIS telco-edge initiatives, are accelerating the country’s interest in compact inference modules. Foxconn’s OEM partnerships support wider adoption by enabling locally assembled systems suitable for telco, enterprise, and public-sector deployments.

*Research Methodology: This report is based on DataCube’s proprietary 3-stage forecasting model, combining primary research, secondary data triangulation, and expert validation. [Learn more]

Market Scope Framework

Product Type

  • GPUs
  • TPUs
  • ASICs
  • FPGAs
  • Neuromorphic Chip

Node Type

  • Standard Accelerator Nodes
  • High-Density Accelerator Nodes
  • Supernode Clusters

Power & Cooling Envelope

  • Envelope 1 ≤ 4 kW
  • Envelope 2 = 4–20 kW
  • Envelope 3 ≥ 20 kW

End-User Segment

  • Hyperscale Cloud Service Providers (CSPs)
  • Large-Scale Internet & AI-Native Companies
  • AI Hardware OEMs / System Integrators
  • Edge/Embedded Device Manufacturers
  • Automotive & Autonomous Systems Manufacturers
  • Semiconductor Manufacturers
  • Other
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