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Turkey Generative AI Chips Market Size and Forecast by Product Type, Node Type, Power & Cooling Envelope, and End-User Segment: 2019-2033

  Dec 2025   | Format: PDF DataSheet |   Pages: 110+ | Type: Niche Industry Report |    Authors: David Gomes (Senior Manager)  

 

Turkey Generative AI Chips Market Outlook

  • In 2024, the market in Turkey held a value of USD 142.6 million.
  • The Turkey Generative AI Chips Market will be USD 1.48 billion by 2033, backed by a CAGR of 23.3% during the forecast period.
  • DataCube Research Report (Nov 2025): This analysis uses 2024 as the actual year, 2025 as the estimated year, and calculates CAGR for the 2025-2033 period.

Industry Assessment Overview

Industry Findings: Turkey’s combination of domestic telco strength and multinational cloud entries is re-shaping procurement: the arrival of a cloud region and deeper telco-cloud partnerships raises demand for AI-ready racks and low-latency accelerator modules. The Google–Turkcell cloud region announcement crystallized local platform demand in Nov-2025, pushing operators toward vendor-certified rack solutions.

Industry Progression: Google and Turkcell’s partnership to establish a Google Cloud region and AI-ready data centre in Türkiye (announced in Nov-2025) signals concrete hyperscaler commitment and creates immediate procurement windows for validated accelerator modules and OEMs that can meet local latency and compliance needs — accelerating integrator-led deployments.

Industry Player Insights: Turkey’s market is influenced by Turkcell, Google Cloud, Türk Telekom, ASELSAN and Vestel. Google–Turkcell regional cloud collaboration creates new procurement pathways for accelerator racks, while domestic defence and telecom OEMs expand integration capabilities for edge and enterprise use cases.
*Research Methodology: This report is based on DataCube’s proprietary 3-stage forecasting model, combining primary research, secondary data triangulation, and expert validation. [Learn more]

Market Scope Framework

Product Type

  • GPUs
  • TPUs
  • ASICs
  • FPGAs
  • Neuromorphic Chip

Node Type

  • Standard Accelerator Nodes
  • High-Density Accelerator Nodes
  • Supernode Clusters

Power & Cooling Envelope

  • Envelope 1 ≤ 4 kW
  • Envelope 2 = 4–20 kW
  • Envelope 3 ≥ 20 kW

End-User Segment

  • Hyperscale Cloud Service Providers (CSPs)
  • Large-Scale Internet & AI-Native Companies
  • AI Hardware OEMs / System Integrators
  • Edge/Embedded Device Manufacturers
  • Automotive & Autonomous Systems Manufacturers
  • Semiconductor Manufacturers
  • Other
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