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Colombia Generative AI Chips Market Size and Forecast by Product Type, Node Type, Power & Cooling Envelope, and End-User Segment: 2019-2033

  Dec 2025   | Format: PDF DataSheet |   Pages: 110+ | Type: Niche Industry Report |    Authors: David Gomes (Senior Manager)  

 

Colombia Generative AI Chips Market Outlook

  • The Colombia industry was valued at USD 277.5 million in 2024.
  • The Colombia Generative AI Chips Market will expand to USD 3.20 billion by 2033, recording a CAGR of 22.8% over the forecast timeframe.
  • DataCube Research Report (Nov 2025): This analysis uses 2024 as the actual year, 2025 as the estimated year, and calculates CAGR for the 2025-2033 period.

Industry Assessment Overview

Industry Findings: Colombia’s data-centre pipeline and improved colocation supply are turning Bogotá into a regional cloud hub; commercial colocation growth is enabling enterprises and hyperscalers to deploy validated accelerator racks locally. This structural shift became visible in market investment reporting and demand signals during Apr-2025, sharpening the procurement path for module and system vendors.

Industry Progression: Recent market reports and investment analyses for Colombia’s data-centre market were published in Apr-2025, showing expanding Tier III colocation capacity and stronger investment interest; this creates immediate opportunities for suppliers of validated accelerator modules and system integrators that can meet colocation SLA and cooling requirements.

Industry Player Insights: Local integrators, together with NVIDIA, Microsoft and IBM cloud presence, are shaping Colombia’s accelerator procurement environment. Telcos such as Tigo provide additional deployment pathways, helping shorten lead times for enterprise and hyperscaler projects by coordinating installation and validation services.
*Research Methodology: This report is based on DataCube’s proprietary 3-stage forecasting model, combining primary research, secondary data triangulation, and expert validation. [Learn more]

Market Scope Framework

Product Type

  • GPUs
  • TPUs
  • ASICs
  • FPGAs
  • Neuromorphic Chip

Node Type

  • Standard Accelerator Nodes
  • High-Density Accelerator Nodes
  • Supernode Clusters

Power & Cooling Envelope

  • Envelope 1 ≤ 4 kW
  • Envelope 2 = 4–20 kW
  • Envelope 3 ≥ 20 kW

End-User Segment

  • Hyperscale Cloud Service Providers (CSPs)
  • Large-Scale Internet & AI-Native Companies
  • AI Hardware OEMs / System Integrators
  • Edge/Embedded Device Manufacturers
  • Automotive & Autonomous Systems Manufacturers
  • Semiconductor Manufacturers
  • Other
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