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GCC AI Memory Chip Market Size and Forecast by Memory Types, Packaging Architectures, and End User: 2019-2033

  Dec 2025   | Format: PDF DataSheet |   Pages: 160+ | Type: Niche Industry Report |    Authors: Surender Khera (Asst. Manager)  

 

GCC AI Memory Chip Market Outlook

  • In 2024, the sector in GCC was valued at USD 231.1 million, representing a year-over-year increase of 21.3%.
  • Industry signals indicate that by 2033, the GCC AI Memory Chip Market is likely to reach USD 3.20 billion, delivering a CAGR of 31.3% over the forecast period.
  • DataCube Research Report (Dec 2025): This analysis uses 2024 as the actual year, 2025 as the estimated year, and calculates CAGR for the 2025-2033 period.

Industry Assessment Overview

Industry Findings: Rapid data-centre expansion and national cloud ambitions reframe memory procurement toward lower-latency, sovereign-ready architectures. A measurable market signal surfaced in May-2024 when industry reports catalogued a substantial uptick in GCC data-centre investment and new regional cloud-region announcements. That investment environment encouraged sovereign and enterprise buyers to demand memory stacks that reduce inter-region traffic, simplify governance compliance, and support energy- and cooling-optimised deployments. The result has been a sharper focus on on-node memory capacity and persistent staging tiers as part of procurement specifications for AI workloads.

Industry Player Insights: Companies including Samsung Electronics, Microsoft, Amazon Web Services, and G42 etc. play a defining role in GCC. Microsoft formalised a sizeable strategic engagement with Abu Dhabi partners in Apr-2024 that included cloud capacity investments and collaborative deployments, which raised local demand for validated high-performance memory and storage options. Separately, Amazon Web Services announced a major data-centre region investment intent for the Kingdom in Mar-2024, which prompted local integrators and hyperscalers to accelerate qualification plans for high-bandwidth memory modules and enterprise SSDs. Together these vendor actions tightened local supply planning and shortened procurement lead times for memory-optimised AI infrastructure.
*Research Methodology: This report is based on DataCube’s proprietary 3-stage forecasting model, combining primary research, secondary data triangulation, and expert validation. [Learn more]

Market Scope Framework

Memory Types

  • Compute-in-Memory (CiM)
  • Near-Memory / On-Package DRAM
  • In-Memory Processing SRAM Blocks

Packaging Architectures

  • 2.5D Co-Packaged AI Memory
  • 3D-Stacked AI Memory
  • AI-Focused Fan-Out Memory Tiles

End User

  • Hyperscalers & Cloud Providers
  • OEMs / System Integrators
  • Accelerator / ASIC Vendors
  • Enterprises / Research Institutions
  • Edge Device Makers

Countries Covered

  • Saudi Arabia
  • UAE
  • Qatar
  • Kuwait
  • Oman
  • Bahrain
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