Industry Findings: Structural scale and hyperscaler procurement remain the single largest demand driver; North America’s combination of concentrated cloud capacity and enterprise AI R&D pushes premium silicon ASPs and bespoke ASIC programs. This dynamic intensified as hyperscalers optimized for energy and cost-per-inference in Dec-2025, increasing demand for chiplets, HBM-attached ASICs and purpose-built accelerators that favor integrated supply-chains and nearshoring.
Industry Progression: Capacity-expansion by cloud and regional infra players is reshaping supply-demand: Vultr’s large Ohio AI cluster announcement (Dec-2025) signals smaller cloud entrants scaling data-centre grade GPU/accelerator capacity and buying at scale; this has immediate knock-on effects for board/module OEMs and ASIC procurement cycles, accelerating orders for high-bandwidth chips and interconnect-capable modules.
Industry Player Insights: Leading vendors influencing the North American market include NVIDIA, Google, AMD, and Intel etc. The competitive pulse is concentrated: NVIDIA’s data-centre GPU iterations, Google’s TPU roadmap (announced in 2024–2025), AMD’s MI-series placements, and Intel’s accelerator pushes all compress margins for niche ASIC start-ups. Example: AWS/Google custom silicon momentum (through 2024–2025) has shifted enterprise procurement to hyperscaler-grade designs, raising ASPs and making system integrators the principal commercial interface.