Industry Findings: Ambitious high-tech incentives and grant schemes changed national procurement horizons and raised the priority of onshore capability for AI compute. The president announced a broad high-tech support initiative in Jul-2024 that included targeted funding and incentive windows for semiconductor and related manufacturing capacity. That policy push led integrators and ministries to prefer memory architectures that can be qualified domestically and to plan for multi-year sourcing that balances high-bandwidth needs with local-content objectives. The net effect improved long-range supply planning and encouraged specification of memory modules that simplify local qualification and thermal management for AI deployments.
Industry Player Insights: A large number of providers operate in Turkey including Intel, Aselsan, Arçelik, and TSMC partnership interests etc. The Turkish HIT-30 high-tech programme announced in Jul-2024 included a dedicated USD 5 billion funding call to stimulate chip production, prompting local OEMs and integrators to reprice procurement timelines and prioritize memory-controller interoperability tests to align with expected domestic capacity improvements. Concurrently, multinational partners signalled intent to participate in the incentive pipeline in 2024–2025, which encouraged system architects to keep high-bandwidth memory options on approved supplier lists while staging fallback commodity DRAM plans to preserve project schedules.