UK AI Memory Chip Market Size and Forecast by Memory Types, Packaging Architectures, and End User: 2019-2033

  Dec 2025   | Format: PDF DataSheet |   Pages: 110+ | Type: Niche Industry Report |    Authors: Surender Khera (Asst. Manager)  

 

UK AI Memory Chip Market Outlook

  • In 2024, market in the UK accounted for USD 1.27 billion.
  • Industry forecasts indicate the UK AI Memory Chip Market will attain USD 4.76 billion by 2033, yielding a CAGR of 14.9% during the forecast interval.
  • DataCube Research Report (Dec 2025): This analysis uses 2024 as the actual year, 2025 as the estimated year, and calculates CAGR for the 2025-2033 period.

Industry Assessment Overview

Industry Findings: Demand for memory tuned to large-model inference rose as national compute capacity plans matured and public research infrastructure expanded. A notable policy milestone occurred in Nov-2023 when the government funded a national AI supercomputer programme worth £225m to accelerate academic and industrial AI research. This investment altered procurement patterns: universities and research consortia now prioritise denser DRAM and larger on-node memory pools to avoid network-bound training phases. The policy push shortened time-to-prototype for memory-intensive models and sharpened the business case for localised AI racks that reduce cross-border data flows while improving latency for domestic services.

Industry Player Insights: UK’s market performance is influenced by Graphcore, Arm, Imagination Technologies, and NMI (New Model Innovations) etc. Graphcore’s corporate restructuring and ownership change in Jul-2024 renewed investor focus on IPU-class compute for model training, which in turn accelerated customer evaluations of tightly integrated memory+processor boards. Later in Nov-2024 the company increased headcount and expanded engineering capacity to speed product iterations and partner integration. These vendor moves raised the visibility of UK-designed accelerator-memory co-design, helping system integrators validate alternatives to traditional GPU+HBM stacks and tightening the feedback loop between design iterations and memory subsystem requirements.

*Research Methodology: This report is based on DataCube’s proprietary 3-stage forecasting model, combining primary research, secondary data triangulation, and expert validation. [Learn more]

Market Scope Framework

Memory Types

  • Compute-in-Memory (CiM)
  • Near-Memory / On-Package DRAM
  • In-Memory Processing SRAM Blocks

Packaging Architectures

  • 2.5D Co-Packaged AI Memory
  • 3D-Stacked AI Memory
  • AI-Focused Fan-Out Memory Tiles

End User

  • Hyperscalers & Cloud Providers
  • OEMs / System Integrators
  • Accelerator / ASIC Vendors
  • Enterprises / Research Institutions
  • Edge Device Makers
×

Request Sample

CAPTCHA Refresh