ASEAN AI Memory Chip Market Size and Forecast by Memory Types, Packaging Architectures, and End User: 2019-2033

  Dec 2025   | Format: PDF DataSheet |   Pages: 160+ | Type: Niche Industry Report |    Authors: Surender Khera (Asst. Manager)  

 

ASEAN AI Memory Chip Market Outlook

  • In 2024, the sector in ASEAN was valued at USD 945.6 million, reflecting a year-over-year growth rate of 34.8%.
  • Forecasts show that, by the end of 2033, the ASEAN AI Memory Chip Market size is expected to reach USD 8.49 billion, registering a CAGR of 26.1% throughout the projection period.
  • DataCube Research Report (Dec 2025): This analysis uses 2024 as the actual year, 2025 as the estimated year, and calculates CAGR for the 2025-2033 period.

Industry Assessment Overview

Industry Findings: Coordinated regional initiatives shifted ASEAN procurement toward memory strategies that favour modularity and local validation. A concrete non-vendor example occurred when the ASEAN Digital Masterplan and related supply-chain frameworks were advanced with renewed emphasis on regional integration in Jun-2025. That cooperative agenda improved cross-border access to testbeds and pilot funding, encouraging integrators to prioritise memory variants that can be prototyped and certified across partner sites. As a result, procurement teams emphasise memory modules with clear qualification paths and manageable thermal envelopes to support quick rollouts across multiple member states while preserving cost efficiency for constrained budgets.

Industry Player Insights: ASEAN’s Regional momentum is led by Western Digital, Seagate Technology, Samsung Electronics, and Micron Technology etc. Western Digital expanded long-term investment and capacity commitments in Malaysia and the broader ASEAN manufacturing base during 2023–2024, improving local availability of enterprise storage and persistent-memory options. Seagate and other storage suppliers also modernised regional assembly and firmware co-development activities in 2023, which helped local cloud and telco operators validate hybrid memory+storage stacks for AI dataset staging. These vendor investments strengthened regional supply resilience and gave operators practical hybrid memory choices to meet performance and endurance requirements.

*Research Methodology: This report is based on DataCube’s proprietary 3-stage forecasting model, combining primary research, secondary data triangulation, and expert validation. [Learn more]

Market Scope Framework

Memory Types

  • Compute-in-Memory (CiM)
  • Near-Memory / On-Package DRAM
  • In-Memory Processing SRAM Blocks

Packaging Architectures

  • 2.5D Co-Packaged AI Memory
  • 3D-Stacked AI Memory
  • AI-Focused Fan-Out Memory Tiles

End User

  • Hyperscalers & Cloud Providers
  • OEMs / System Integrators
  • Accelerator / ASIC Vendors
  • Enterprises / Research Institutions
  • Edge Device Makers

Countries Covered

  • Malaysia
  • Indonesia
  • Singapore
  • Thailand
  • Vietnam
  • Philippines
×

Request Sample

CAPTCHA Refresh