India AI Memory Chip Market Size and Forecast by Memory Types, Packaging Architectures, and End User: 2019-2033

  Dec 2025   | Format: PDF DataSheet |   Pages: 110+ | Type: Niche Industry Report |    Authors: Surender Khera (Asst. Manager)  

 

India AI Memory Chip Market Outlook

  • In 2024, the Indian industry was valued at USD 619.3 million.
  • Regional outlook suggests the India AI Memory Chip Market is expected to be USD 10.07 billion by 2033, registering a CAGR of 34.0% throughout the forecast period.
  • DataCube Research Report (Dec 2025): This analysis uses 2024 as the actual year, 2025 as the estimated year, and calculates CAGR for the 2025-2033 period.

Industry Assessment Overview

Industry Findings: Domestic compute strategy is shifting as policymakers and anchor projects strengthen local semiconductor assembly and test capacity. A significant policy milestone occurred when the Union Cabinet approved semiconductor project allocations and related support measures in Jun-2023, which signalled clear government backing for downstream capacity and supplier ecosystems. That decision nudged system architects to prioritise memory architectures that reduce import exposure while enabling scalable on-premise AI rigs for research and enterprise use. As procurement cycles lengthened to accommodate localisation clauses, integrators and data-centre operators began favouring memory modules with predictable qualification pathways and resilient supply profiles to avoid deployment delays and cost volatility.

Industry Player Insights: Indian industry shifts are guided by Samsung Electronics, Micron Technology, SK hynix, and Kioxia etc. Micron confirmed plans for a new assembly and test facility in Gujarat in Jun-2023 to address regional DRAM and NAND demand, expanding localised capacity and shortening supply lead times for Indian integrators. In a separate development, Samsung inaugurated an expanded semiconductor R&D facility in Bengaluru in Feb-2024 to accelerate component validation and developer outreach. Together these vendor actions increased local access to qualified memory formats and reduced the time systems teams need to certify memory stacks for AI workloads.

*Research Methodology: This report is based on DataCube’s proprietary 3-stage forecasting model, combining primary research, secondary data triangulation, and expert validation. [Learn more]

Market Scope Framework

Memory Types

  • Compute-in-Memory (CiM)
  • Near-Memory / On-Package DRAM
  • In-Memory Processing SRAM Blocks

Packaging Architectures

  • 2.5D Co-Packaged AI Memory
  • 3D-Stacked AI Memory
  • AI-Focused Fan-Out Memory Tiles

End User

  • Hyperscalers & Cloud Providers
  • OEMs / System Integrators
  • Accelerator / ASIC Vendors
  • Enterprises / Research Institutions
  • Edge Device Makers
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