Vietnam AI Memory Chip Market Size and Forecast by Memory Types, Packaging Architectures, and End User: 2019-2033

  Dec 2025   | Format: PDF DataSheet |   Pages: 110+ | Type: Niche Industry Report |    Authors: Surender Khera (Asst. Manager)  

 

Vietnam AI Memory Chip Market Outlook

  • In 2024, the Vietnam industry revenue reflected USD 107.7 million.
  • By 2033, the Vietnam AI Memory Chip Market is anticipated to be worth USD 1.84 billion, growing at a CAGR of 32.2% during the projection period.
  • DataCube Research Report (Dec 2025): This analysis uses 2024 as the actual year, 2025 as the estimated year, and calculates CAGR for the 2025-2033 period.

Industry Assessment Overview

Industry Findings: Regulatory reform and targeted industrial funds have accelerated memory-related capacity planning nationwide. A decisive non-vendor action was issuance of investment-support and semiconductor-enabling measures in Dec-2024 that align incentives for fabs, OSATs, and AI R&D. That intervention encouraged integrators and system planners to include local-content scenarios in sourcing models and to prioritise memory architectures that support onshore validation and staged dataset persistence. The practical consequence was faster local certification cycles and more conservative refresh plans that favour proven memory modules with clear upgrade paths.

Industry Player Insights: The market in Vietnam consists of numerous players, including Samsung Electronics, Western Digital, Micron Technology, and SK hynix etc. Samsung Display announced a US$1.8 billion OLED manufacturing investment in Sep-2024, expanding advanced electronics capacity in northern provinces and indirectly strengthening the local supply ecosystem for memory-adjacent components. In a separate development, global contract-manufacturing and assembly groups increased footprint investments in 2024–2025 that improved local packaging and subsystem options; these changes helped integrators shorten lead times when qualifying memory+controller pairings for AI edge appliances. Together these vendor developments improved procurement certainty for Vietnamese AI deployments.

*Research Methodology: This report is based on DataCube’s proprietary 3-stage forecasting model, combining primary research, secondary data triangulation, and expert validation. [Learn more]

Market Scope Framework

Memory Types

  • Compute-in-Memory (CiM)
  • Near-Memory / On-Package DRAM
  • In-Memory Processing SRAM Blocks

Packaging Architectures

  • 2.5D Co-Packaged AI Memory
  • 3D-Stacked AI Memory
  • AI-Focused Fan-Out Memory Tiles

End User

  • Hyperscalers & Cloud Providers
  • OEMs / System Integrators
  • Accelerator / ASIC Vendors
  • Enterprises / Research Institutions
  • Edge Device Makers
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